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| 2 a b u s t e r m i n a t i o n r e g u l a t o r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . sourcing and sinking current up to 2a vcntl supply voltage range: 3.1v to 5.5v vin supply voltage range: 1.2v to 3.6v vtt and vttref voltage tracks at half the vref voltage vtt and vttref voltage with 10mv accuracy excellent load transient response stable with 10 m f ceramic output capacitor current-limit protection thermal shutdown protection power-on-reset function on vcntl s3, s5 input signals for acpi states small msop-10p, dfn2x2-8 and tdfn3x3-10 packages lead free and green devices available (rohs compliant) f e a t u r e s a p p l i c a t i o n s g e n e r a l d e s c r i p t i o n the apl5338a linear regulator is designed to provide a regulated voltage with bi-directional output current for ddr-sdram termination. the apl5338a integrates two power transistors to source or sink current up to 2a. it also incorporates current-limit and thermal shutdown into a single chip. the output voltage of apl5338a tracks the voltage at vref pin. an internal resistor divider is used to provide a half voltage of vref for vttref and vtt voltage. the vtt output voltage is only requiring 10 m f of ceramic output capacitance for stability and fast transient response. the s3 and s5 pins provide the sleep state for vtt (s3 state) and suspend state (s4/s5 state) for device when s5 and s3 are both pulled low the device provides the soft-off for vtt and vttref. the msop-10p, dfn2x2-8 and tdfn3x3-10 packages with a copper pad is available which provides excellent thermal impedance. ddr 2/3 memory termination s i m p l i f i e d a p p l i c a t i o n c i r c u i t vref vtt vin pgnd vttsns vcntl s 5 gnd s 3 vttref apl 5338 a 1 2 3 4 5 6 9 8 7 10 c in 10 m f c out 10 m f c 1 0 . 1 m f
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 2 p i n c o n f i g u r a t i o n m s o p - 1 0 p ( t o p v i e w ) tdfn 3 x 3 - 10 ( top view ) vtt 3 10 vcntl vref 1 vin 2 vttsen 5 9 s 5 7 s 3 8 gnd pgnd 4 6 vttref = exposed pad ( connected to ground plane for better heat dissipation ) gnd vin 2 9 s 5 vtt 3 pgnd 4 8 gnd 7 s 3 10 vcntl vref 1 vttsen 5 6 vttref gnd dfn - 2 x 2 - 8 ( top view ) = exposed pad ( connected to vcntl plane for better heat dissipation ) vtt 3 8 s 5 vref 1 vin 2 pgnd 4 7 gnd 5 vttref 6 s 3 v c n t l o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . package code xa : msop - 10 p qb : tdfn 3 x 3 - 10 qa : dfn 2 x 2 - 8 operating ambient temperature range i : - 40 to 85 o c handling code tr : tape & reel assembly material g : halogen and lead free device apl 5338 a handling code temperature range package code apl 5338 a xa : xxxxx - date code assembly material l 5338 xxx xx apl 5338 a qb : xxxxx - date code apl 5338 xxxxx apl 5338 a qa : xxxxx - date code 338 a x c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 3 symbol parameter rating unit v cntl vcntl supply voltage (vcntl to gnd) - 0.3 ~ 7 v v in vin supply voltage (vin to gnd) - 0.3 ~ v cntl + 0.3 v v tt vtt output voltage (vtt to gnd) - 0.3 ~ v in + 0.3 v v ttref vttref output voltage (vttref to gnd) - 0.3 ~ v in + 0.3 v v ref vref input voltage (vref to gnd) - 0.3 ~ 7 v vttsns, s3 and s5 voltage - 0.3 ~ 7 v pgnd to gnd voltage - 0.3 ~ 0.3 v t j maximum junction temperature 150 o c t stg storage temperature range - 65 ~ 150 o c t sdr maximum lead soldering temperature , 10 seconds 26 0 o c a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja junction - to - ambient resistance in f ree a ir (note 2) msop - 10p tdfn3x3 - 10 dfn2x2 - 8 6 0 60 80 o c/w note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. the exposed pad of msop-10p and tdfn3x3-10 is soldered directly on the pcb. n o t e 1 : s t r e s s e s b e y o n d t h o s e l i s t e d u n d e r " a b s o l u t e m a x i m u m r a t i n g s " m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e . t h e s e a r e s t r e s s r a t i n g s o n l y a n d f u n c t i o n a l o p e r a t i o n o f t h e d e v i c e a t t h e s e o r a n y o t h e r c o n d i t i o n s b e y o n d t h o s e i n d i c a t e d u n d e r " r e c o m - m e n d e d o p e r a t i n g c o n d i t i o n s " i s n o t i m p l i e d . e x p o s u r e t o a b s o l u t e m a x i m u m r a t i n g c o n d i t i o n s f o r e x t e n d e d p e r i o d s m a y a f f e c t d e v i c e r e l i a b i l i t y . symbol parameter range unit v cntl vcntl to gnd 3.1 ~ 5.5 v v in vin to gnd (v in c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 5 e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) ap l5338a symbol parameter test conditions min . typ . max . unit logic threshold v ih high threshold voltage v s3 , v s5 rising 1.6 - - v il low threshold voltage v s3 , v s5 falling - - 0.4 s3, s5 hysteresis - 0.2 - v leakage current s3, s5, t j =25 o c - - 4 m a thermal shutdown t sd thermal shutdown temperature t j rising - 150 - thermal shutdown hysteresis - 30 - o c unless otherwise specified, these specifications apply over v cntl =5v, v in =v ref =1.8v, c in =10 m f, c out =10 m f and t a = -40 ~ 85 o c. typical values are at t a =25 o c. c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 6 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s v t t r e f o u t p u t v o l t a g e ( v ) junction temperature ( o c) vttref output voltage vs. temperature v cntl =5v v in =v ref =1.8v i vttref =0ma 0.890 0.892 0.894 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 -40 -20 0 20 40 60 80 100 120 140 junction temperature ( o c) v i n s u p p l y c u r r e n t ( m a ) vin supply current vs. temperature v cntl =5v v s3 =v s5 =5v -40 -20 0 20 40 60 80 100 120 140 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 vtt output voltage vs. temperature v t t o u t p u t v o l t a g e ( v ) junction temperature ( o c) v cntl =5v v in =v ref =1.8v i vtt =-10ma i vtt =10ma -40 -20 0 20 40 60 80 100 120 140 0.890 0.892 0.894 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 junction temperature ( o c) v c n t l s u p p l y c u r r e n t ( m a ) vcntl supply current vs. temperature v cntl =5v v s3 =v s5 =5v 0.40 0.45 0.50 0.55 0.60 -40 -20 0 20 40 60 80 100 120 140 junction temperature ( o c) v c n t l s h u t d o w n c u r r e n t ( m a ) vcntl shutdown current vs. temperature v cntl =5v v s3 =v s5 =0v -40 -20 0 20 40 60 80 100 120 140 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 junction temperature ( o c) v i n s h u t d o w n c u r r e n t ( m a ) vin shutdown current vs. temperature v cntl =5v v s3 =v s5 =0v -40 -20 0 20 40 60 80 100 120 140 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) junction temperature ( o c) v t t r e f d i s c h a r g e c u r r e n t ( m a ) vttref discharge current vs. temperature v cntl =5v v s2 =v s5 =0v v ttref =0.5v -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 vtt discharge current vs. temperature v t t d i s c h a r g e c u r r e n t ( m a ) junction temperature ( o c) v cntl =5v v s2 =v s5 =0v v tt =0.5v -40 -20 0 20 40 60 80 100 120 140 10 15 20 25 30 35 40 vttref voltage vs. vttref load current (ddr2) v t t r e f v o l t a g e ( v ) vttref load current (ma) 0 2 4 6 8 10 v cntl =5v v in =v ref =1.8v 0.890 0.892 0.894 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 vttref voltage vs. vttref load current (ddr3) v t t r e f v o l t a g e ( v ) vttref load current (ma) v cntl =5v v in =v ref =1.5v 0.740 0.742 0.744 0.746 0.748 0.750 0.752 0.754 0.756 0.758 0.760 0 2 4 6 8 10 vtt voltage vs. vtt load current (ddr2) v t t v o l t a g e ( v ) vtt load current (a) v cntl =5v v in =v ref =1.8v 0.890 0.892 0.894 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 vtt voltage vs. vtt load current (ddr3) v t t v o l t a g e ( v ) vtt load current (a) v cntl =5v v in =v ref =1.5v 0.740 0.742 0.744 0.746 0.748 0.750 0.752 0.754 0.756 0.758 0.760 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 8 o p e r a t i n g w a v e f o r m s s t a r t u p w a v e f o r m - s 5 l o w t o h i g h s t a r t u p w a v e f o r m - s 3 l o w t o h i g h ch1: v s5 , 5v/div, dc time:100 m s/div ch2: v s3 , 5v/div, dc ch3: v ttref , 500mv/div, dc ch4: v tt , 500mv/div, dc i vtt =i vttref =0a ch1: v s5 , 5v/div, dc time:100 m s/div ch2: v s3 , 5v/div, dc ch3: v ttref , 500mv/div, dc ch4: v tt , 500mv/div, dc i vtt =i vttref =0a 2 3 1 4 v s5 v ttref v s3 v tt s h u t d o w n w a v e f o r m - s 3 h i g h t o l o w s h u t d o w n w a v e f o r m - s 3 a n d s 5 h i g h t o l o w ch1: v s5 , 5v/div, dc time:100 m s/div ch2: v s3 , 5v/div, dc ch3: v ttref , 500mv/div, dc ch4: v tt , 500mv/div, dc i vtt =i vttref =0a ch1: v s5 , 5v/div, dc time:100 m s/div ch2: v s3 , 5v/div, dc ch3: v ttref , 500mv/div, dc ch4: v tt , 500mv/div, dc i vtt =i vttref =0a 2 3 1 4 v s5 v ttref v s3 v tt ( r e f e r t o t h e s e c t i o n ? t y p i c a l a p p l i c a t i o n c i r c u i t s ? v c n t l = 5 v , v i n = v r e f = 1 . 8 v , t a = 2 5 o c ) v s5 v ttref 2 3 1 4 v s3 v tt v s5 v ttref 2 3 1 4 v s3 v tt c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 9 o p e r a t i n g w a v e f o r m s ( c o n t . ) v t t l o a d t r a n s i e n t r e s p o n s e ch1: v ttref , 50mv/div, dc time:100 m s/div ch2: v tt , 50mv/div, dc ch3: i vtt , 2a/div, dc i vtt =-2a (sink) to 2a (source) to -2a 2 3 1 i vtt v ttref v tt p i n d e s c r i p t i o n pin tdfn3x3 - 10 msop - 10p dfn2x2 - 8 name i/o func tion 1 1 1 vref i reference voltage input for vtt and vttref regulator. 2 2 2 vin i power input for vtt and vttref pin. an input capacitor should be connected from vin to pgnd. 3 3 3 vtt o vtt output volt age pin. source and sink current up to 2a. to insure the stability issue, the output capacitor typical 10 m f should be connected from vtt to pgnd. 4 4 4 pgnd i/o power ground for vin and vtt. 5 5 - vttsns i voltage sense for vtt. connect to the positive node of v tt output capacitors. 6 6 5 vttref o vtt reference output pin. a small capacitor 0.1 m f should be connected from vttref to gnd. 7 7 6 s3 i s3 signal input. 8 8 7 gnd i/o signal ground. 9 9 8 s5 i s 5 signal input. 10 10 exposed pad vcntl i power input for internal control circuitry. a bypass capacitor 0.1 m f should be connected near the pin. expos ed pad exposed pad - gnd i/o signal ground. ( r e f e r t o t h e s e c t i o n ? t y p i c a l a p p l i c a t i o n c i r c u i t s ? v c n t l = 5 v , v i n = v r e f = 1 . 8 v , t a = 2 5 o c ) c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 0 b l o c k d i a g r a m soft-start and control logic por thermal shutdown current limit vref vcntl s3 s5 pgnd vtt vttref vin vttsen gnd t y p i c a l a p p l i c a t i o n c i r c u i t v tt 0 . 9 / 0 . 75 / 0 . 675 v - 2 ~ + 2 a vref vtt vin pgnd vttsns vcntl s 5 gnd s 3 vttref apl 5338 a c in 10 m f c out 10 m f c 1 0 . 1 m f v in 1 . 8 / 1 . 5 / 1 . 35 v v cntl 5 v c 2 0 . 1 m f c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 1 f u n c t i o n d e s c r i p t i o n vtt source/sink regulator the apl5338a is a low dropout source/sink linear regu- lator with maximum 2a source/sink current. two internal n-channel mosfets controlled by separate high band- width error amplifiers regulate the output voltage by sourc- ing current from vin or sinking current to pgnd. to pre- vent two pass elements from shoot-through, a voltage offset is created between two positive inputs of the error amplifiers. p o w e r - o n - r e s e t ( p o r ) the apl5338a monitors the vcntl pin voltage for power- on-reset function to prevent erroneous operation. the built-in por circuit keeps the outputs shutoff until inter- nal circuit is operating properly. typical por threshold is 2.8v with 0.2v hysteresis. vttref regulator vttref voltage follows 1/2vref voltage which is the reference of the vtt regulator. the vttref block con- sists of a resistor divider and a low pass filter. the regu- lator can source current up to 20ma (typical). to insure the stability, a 0.1 m f ceramic capacitor should be con- nected from vttref to gnd. soft-start and current limit the apl5338a monitors the output current, both sourc- ing and sinking current, and limits the maximum output current to prevent damages during current overload or short circuit (shorted from vout to gnd or vin) conditions. the apl5338a provides a soft-start function, using the constant current to charge the output capacitor that gives a rapid and linear output voltage rise. if the load current is above the current limit start-up, the vtt cannot start successfully. table1. the truth table of s3 and s5 pins state s3 s5 vttref vtt s0 h h 1 1 s3 l h 1 0(high - z) s4/5 l l 0(discharge) 0(discharge) s3, s5 control the s3 and s5 signals control the vtt and vttref states and these pins should be connected to slp_s3 and slp_s5 signals respectively. the table1 shows the truth table of the s3 and s5 pins. when both s3 and s5 are above the logic threshold voltage, the vtt and vttref are turned on at s0 state. when s3 is low and s5 is high, the vtt voltage is disabled and left high impedance in s3 state. when both s3 and s5 are low, the vtt and vttref are turned off and discharged to the ground through internal mosfets during s4/s5 state. (note that if the s3 is forced high and s5 is forced low, then vttref is discharged and vtt is at high-z state. such condition is not recommended.) thermal shutdown a thermal shutdown circuit limits the junction tempera- ture of the apl5338a. when the junction temperature ex- ceeds +150 o c , the device will turn off the mosfets, al- lowing the device to cool down. the regulator regulates the output again through initiation of a new soft-start cycle after the junction temperature cools by 30 o c , resulting in a pulsed output during continuous thermal overload conditions. the thermal shutdown is designed with a 30 o c hysteresis to lower the average junction tempera- ture during continuous thermal overload conditions, ex- tending lifetime of the device. for normal operation, de- vice power dissipation should be externally limited so that junction temperatures will not exceed +125 o c . c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 2 a p p l i c a t i o n i n f o r m a t i o n i n p u t c a p a c i t o r t h e a p l 5 3 3 8 a r e q u i r e s p r o p e r i n p u t c a p a c i t o r s t o s u p p l y s u r g e c u r r e n t d u r i n g s t e p p i n g l o a d t r a n s i e n t s t o p r e v e n t t h e i n p u t r a i l f r o m d r o p p i n g . b e c a u s e t h e p a r a s i t i c i n d u c - t o r f r o m t h e v o l t a g e s o u r c e s o r o t h e r b u l k c a p a c i t o r s t o t h e v i n l i m i t s t h e s l e w r a t e o f t h e s u r g e c u r r e n t , i t i s n e c - e s s a r y t o p l a c e t h e i n p u t c a p a c i t o r s n e a r v i n a s c l o s e a s p o s s i b l e . i n p u t c a p a c i t o r s s h o u l d b e g r e a t e r t h a n 1 0 m f . a capacitor of 0.1 m f (mlcc) or above is recommended for vcntl pin noise decoupling. o u t p u t c a p a c i t o r t h e a p l 5 3 3 8 a n e e d s a p r o p e r o u t p u t c a p a c i t o r t o m a i n - t a i n c i r c u i t s t a b i l i t y a n d i m p r o v e t r a n s i e n t r e s p o n s e o v e r t e m p e r a t u r e a n d c u r r e n t . i n o r d e r t o i n s u r e t h e c i r c u i t s t a b i l i t y , a 10 m f mlcc (minimum) as an output capacitor must be placed near the vtt. w i t h x 5 r a n d x 7 r d i e l e c t r i c s . t h e r m a l c o n s i d e r a t i o n t h e a p l 5 3 3 8 a m a x i m u m p o w e r d i s s i p a t i o n d e p e n d s o n t h e d i f f e r e n c e s o f t h e t h e r m a l r e s i s t a n c e a n d t e m p e r a - t u r e b e t w e e n j u n c t i o n a n d a m b i e n t a i r . t h e p o w e r d i s s i - p a t i o n p d a c r o s s t h e d e v i c e i s : p d = ( t j - t a ) / q j a w h e r e ( t j - t a ) i s t h e t e m p e r a t u r e d i f f e r e n c e b e t w e e n t h e j u n c t i o n a n d a m b i e n t a i r . q j a i s t h e t h e r m a l r e s i s t a n c e b e t w e e n j u n c t i o n a n d a m b i e n t a i r . a s s u m i n g t h e t a = 2 5 c a n d m a x i m u m t j = 1 5 0 c ( t y p i c a l t h e r m a l l i m i t t h r e s h o l d ) , t h e m a x i m u m p o w e r d i s s i p a t i o n i s c a l c u l a t e d a s : p d ( m a x ) = ( 1 5 0 - 2 5 ) / 6 0 = 2 . 0 8 ( w ) f o r t d f n 3 x 3 - 1 0 / m s o p - 1 0 p p a c k a g e s p d ( m a x ) = ( 1 5 0 - 2 5 ) / 8 0 = 1 . 5 6 ( w ) f o r d f n 2 x 2 - 8 p a c k a g e l a y o u t c o n s i d e r a t i o n f i g u r e 1 i l l u s t r a t e s t h e l a y o u t . b e l o w i s a c h e c k l i s t f o r y o u r l a y o u t : 1 . p l e a s e p l a c e t h e i n p u t c a p a c i t o r s c l o s e t o t h e v i n . 2 . o u t p u t c a p a c i t o r s f o r v t t m u s t b e c l o s e t o t h e p i n w i t h s h o r t a n d w i d e t r a c k . 3 . v t t s n s s h o u l d b e c o n n e c t e d t o t h e o u t p u t c a p a c i t o r s o f v t t s e p a r a t e d f r o m l a r g e c u r r e n t p a t h t o a v o i d e f - f e c t o f e s r a n d e s l . t h e e s r a n d e s l o f g r o u n d t r a c k b e t w e e n v t t a n d g n d s h o u l d b e m i n i m i z e d . 4 . vref should be connected to vin by a separate track. vref is the reference voltage of vttref, so avoid any noise to get into the vref. 5. pgnd is the ground of vin and vtt. g n d i s t h e s i g n a l g r o u n d o f v r e f , v t t r e f s 3 a n d s 5 . g n d a n d p g n d s h o u l d b e i s o l a t e d w i t h a s i n g l e p o i n t c o n n e c t i o n b e - t w e e n t h e m . 6 . s o l d e r i n g t h e e x p o s e d p a d t o g r o u n d i s g o o d f o r h e a t s i n k i n g . n u m e r o u s v i a s 0 . 3 3 m m i n d i a m e t e r c o n - n e c t e d f r o m t h e t h e r m a l l a n d t o t h e i n t e r n a l / s o l d e r - s i d e g r o u n d p l a n e ( s ) s h o u l d b e u s e d t o e n h a n c e d i s s i p a t i o n . l a r g e g r o u n d p l a n e i s g o o d f o r h e a t s i n k i n g . o p t i m u m p e r f o r m a n c e c a n o n l y b e a c h i e v e d w h e n t h e d e v i c e i s m o u n t e d o n a p c b o a r d a c c o r d i n g t o t h e b o a r d l a y o u t d i a g r a m s w h i c h a r e s h o w n a s f i g u r e 2 . f i g u r e 1 v tt vref vtt vin pgnd vttsns vcntl s 5 gnd s 3 vttref apl 5338 a c in c out c 1 v in v cntl 5 v c 2 f o r n o r m a l o p e r a t i o n , d o n o t e x c e e d t h e m a x i m u m o p e r - a t i n g j u n c t i o n t e m p e r a t u r e o f t j = 1 2 5 o c . t h e c a l c u l a t e d p o w e r d i s s i p a t i o n s h o u l d b e l e s s t h a n : p d = ( 1 2 5 - 2 5 ) / 6 0 = 1 . 6 6 ( w ) f o r t d f n 3 x 3 - 1 0 / m s o p - 1 0 p p a c k a g e s p d = ( 1 2 5 - 2 5 ) / 8 0 = 1 . 2 5 ( w ) f o r d f n 2 x 2 - 8 p a c k a g e t h e exposed pad p r o v i d e s a n e l e c t r i c a l c o n n e c t i o n t o g r o u n d a n d c h a n n e l s h e a t a w a y . c o n n e c t t h e exposed pad t o g r o u n d b y u s i n g a l a r g e g r o u n d p l a n e . c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 3 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) l a y o u t c o n s i d e r a t i o n ( c o n t . ) f i g u r e 2 . m s o p - 1 0 p p a c k a g e r e c o m m e n d e d l a y o u t recommended minimum footprint apl 5338 a vin vtt pgnd gnd c out for dissipating heat vcntl c in c 1 c 2 pgnd gnd 0 . 1 8 1 0 . 0 6 1 0.020 0.010 1 2 3 4 8 7 6 5 0 . 0 9 8 0.098 unit : inch 10 9 8 7 5 6 m s o p - 8 p 0 . 012 0 . 062 0 . 024 0 . 02 unit : inch 0 . 012 the via diameter = 0 . 012 hole size = 0 . 008 0 . 0 9 6 5 t d f n 3 x 3 - 1 0 d f n 2 x 2 - 8 0 . 012 0 . 02 0 . 0118 0 . 0315 0 . 022 0 . 0 5 1 the via diameter = 0 . 012 hole size = 0 . 008 unit : inch ground plane for thermal pad c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 4 p a c k a g e i n f o r m a t i o n m s o p - 1 0 p a 0 l view a 0 . 2 5 gauge plane seating plane a 1 a 2 s y m b o l min. max. 1.10 0.00 0.17 0.33 0.08 0.23 0.15 a a1 b c d e e1 e l millimeters a2 0.75 0.95 0.50 bsc msop-10p 0.40 0.80 0.020 bsc min. max. inches 0.043 0.000 0.030 0.037 0.007 0.013 0.003 0.009 0.016 0.031 0 0.006 0 8 0 8 4.70 5.10 2.90 3.10 2.90 3.10 0.114 0.122 0.185 0.201 0.114 0.122 note: 1. follow jedec mo-187 ba-t. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not flash or protrusions. 3. dimension ? e1 ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 6 mil per side. exposed pad e b d d1 e 1 e 2 e e2 1.50 2.50 0.059 0.098 d1 1.50 2.50 0.059 0.098 see view a c c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 5 p a c k a g e i n f o r m a t i o n t d f n 3 x 3 - 1 0 0.70 0.069 0.028 0.002 0.50 bsc 0.020 bsc 0.20 0.008 k 2.90 3.10 0.114 0.122 2.90 3.10 0.114 0.122 s y m b o l min. max. 0.80 0.00 0.18 0.30 2.20 2.70 0.05 1.40 a a1 b d d2 e e2 e l millimeters a3 0.20 ref tdfn3x3-10 0.30 0.50 1.75 0.008 ref min. max. inches 0.031 0.000 0.007 0.012 0.087 0.106 0.055 0.012 0.020 note : 1. followed from jedec mo-229 veed-5. pin 1 corner e l k e 2 d2 a1 a3 b a e pin 1 d c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 6 note : 1. follow from jedec mo-229 wccd-3. p a c k a g e i n f o r m a t i o n d f n 2 x 2 - 8 min . max . 1 . 00 0 . 00 0 . 18 0 . 30 1 . 00 1 . 60 0 . 05 0 . 60 a a 1 b d d 2 e e 2 e l millimeters a 3 0 . 20 ref dfn 2 x 2 - 8 0 . 30 0 . 45 1 . 00 0 . 008 ref min . max . inches 0 . 039 0 . 000 0 . 007 0 . 012 0 . 039 0 . 063 0 . 024 0 . 012 0 . 018 0 . 80 0 . 039 0 . 031 0 . 002 0 . 50 bsc 0 . 016 bsc s y m b o l 1 . 90 2 . 10 0 . 075 0 . 083 1 . 90 2 . 10 0 . 075 0 . 083 d e pin 1 dot a b a 1 a 3 nx aaa c seating plane d 2 e 2 l e pin 1 corner k k 0 . 20 0 . 008 aaa 0 . 08 0 . 003 c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 7 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 msop - 10p 4.00 ? 0.10 8.00 ? 0.10 2.00 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 5.30 ? 0.20 3.30 ? 0.20 1.40 ? 0.20 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 tdfn3x3 - 10 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.0 5 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 3.30 ? 0.20 3.30 ? 0.20 1.30 ? 0.20 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.20 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 dfn2x2 - 8 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 2.35 ? 0.20 2..35 ? 0.20 1.30 ? 0.20 (mm) d e v i c e s p e r u n i t c a r r i e r t a p e & r e e l d i m e n s i o n s package type unit quantity msop - 10p tape & reel 3000 tdfn3x3 - 10 tape & reel 3000 dfn2x2 - 8 tape & reel 3000 a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 8 t a p i n g d i r e c t i o n i n f o r m a t i o n msop-10p user direction of feed t d f n 3 x 3 - 1 0 user direction of feed d f n 2 x 2 - 8 user direction of feed c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 1 9 c l a s s i f i c a t i o n p r o f i l e c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 2 0 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c r e l i a b i l i t y t e s t p r o g r a m test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ t j =125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - a u g . , 2 0 1 3 a p l 5 3 3 8 a w w w . a n p e c . c o m . t w 2 1 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8 |
Price & Availability of APL5338AQBI-TRG
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